Hangzhou Xuhong Technology Co.,Ltd
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中文
In the circuit component of the TFT LCD , in addition to the resistance, capacitor and inductor,the most important composition is driving IC, that is, integrated circuit chip. Commonly used drive ICs include power IC, timing control IC, data cable drive IC, scanning cable drive IC, low -voltage differential stabilizer IC, EEPROM, etc. Below, let's introduce the packaging method of driving IC. In TFT LCD, there are three kinds of packaging method of driving ICs:TCP, COF, and COG.
The driver IC in the COG is pressed on the glass in the form of a bare film. In TCP and COF, the driver IC is pressed on the TAB glue strip, and then protected with epoxy resin glue. The substrate of the TAB rubber strip is a polyamide tape. The base material is applied to the copper foil after the adhesive. The wiring pattern on the copper foil is formed by carving according to the BUMP definition of the driver IC.
TCP packaging is a technology that combines the BUMP of drives IC with the CU pin on the polytamide tape by common crystal welding, and is protected by epoxy resin seals. TCP consists of three -layer materials. If TCP needs to be bent, two more slits are added to the TCP. As a result, the total length increases and the cost is increased.
COF uses kind of grain soft film packaging technology, which consists of polytamide layer and copper foil layer. The thickness of COF is relatively thin. When you encounter a place where the structural design needs to be bending, you can directly bend. The structure of the COF is similar to the FPC of a single -layer board. In addition to the different glue used, the thickness and bending of COF are better than FPC. Because COF is thin and short, the package density is high, and most of them are two -layer membrane structures,connecting the display, PCB, and IC components on the same plane.
In summary, the mainstream driving chip packaging method has its own advantages and disadvantages. However, the current TFT LCD on the market still uses COG as the main driving IC packaging method.
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